Seavey Engineering has perfected improved microstrip arrays. These arrays have increased RF bandwidth and are simple to fabricate. Passive parasitic elements are placed in front of each patch element. The RF distribution network is incorporated on the same circuit board as the patch elements. The array comprises a single printed and etched board with a low-cost set of parasites spaced above the board. Most arrays of this type incorporate sealed, thermoformed ABS covers for environmental protection.
Designs always use the lowest cost dielectric materials for the requirements at hand. For lower frequency applications, we have pioneered in the use of commercial polyphenylene oxide dielectric substrates. This material is low cost, lightweight and is compatible with standard plating, printing and etching methods. We also routinely use FR4 and all varieties of teflon-filled glass laminates.
 Model 9500-800 0.86 - 0.91 GHz 5 dBi |
 Model 9533-815 0.902 - 0.928 GHz 18 dBi |
  Model 9440-800 1.4 - 1.5 GHz 15 dBi |
 Model 9440-810 1.4 - 1.5 GHz 12.4 dBic |
 Model 9149-800 1.52 - 1.66 GHz 17.3 dBic |
 Model 9398-800 1.52 - 1.56 GHz 18.3 dBic |